ZURICH, Switzerland – April 8, 2025 – QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, samples its innovative Wi-Fi 7 CMOS front-end module (FEM) to two Tier-1 mobile SoC players. The QWX27120, a 5-7 GHz CMOS FEM designed for Wi-Fi 7, fully integrates a patent-pending power amplifier (PA) architecture, an SP3T switch, and a low-noise-amplifier (LNA) into a monolithic CMOS die. Optimized for Wi-Fi 7 applications in smartphones, AR/ VR, tablets, laptops and smart home devices, this all-silicon solution outperforms competing GaAs and SiGe products in power efficiency, size, RF performance, and cost.
The QWX27120, part of the QuantalRF Elementum™ family of Wi-Fi 7 products, builds on the success of the its predecessors with enhanced features, including a power detector output. Fabricated in CMOS SOI technology, the QWX27120 leverages QuantalRF’s unique PA architecture to reduce power consumption, enabling devices to achieve a longer battery life and reduce heat dissipation. The CMOS FEM also enables a high degree of on-chip configurability, allowing for the versatile reconfiguration for different supply voltages, channels, and linear/ non-linear operational modes. Selectable high/low transmit gain modes and digital pre-distortion (DPD) further improve power efficiency.
“Wi-Fi 7’s advanced features and higher data rates pose significant power consumption challenges,” said Dr. Ali Fard, CEO and CTO of QuantalRF. “Our innovative PA architecture—integrated within a monolithic CMOS SOI platform—delivers superior linear output power and best-in-class power efficiency. With the QWX27120 Wi-Fi 7 FEM now sampling, we are ready to collaborate with more customers to turbocharge their Wi-Fi efficiency with intelligent and adaptive technology.”
QWX27120 Features & Benefits:
- Wi-Fi 6E and Wi-Fi 7 compatible – supports 5150–7125 MHz
- Superior power efficiency – reduces power consumption by up to 50-percent
- Power detector output – provides real-time power monitoring
- Ultra-small form factor – integrates all RF front-end components into a single die, available in a 2 x 2mm LGA package or as a flip-chip die.
Samples and evaluation kits are now available. Contact QuantalRF for more information.
Media Contact:
Dave Aichele
EVP Sales & Business Development
dave.aichele@quantalrf.com
+1 858-401-6444
