{"id":2178,"date":"2025-04-08T13:11:28","date_gmt":"2025-04-08T13:11:28","guid":{"rendered":"https:\/\/quantalrf.com\/wp1\/?p=2178"},"modified":"2026-05-15T21:52:44","modified_gmt":"2026-05-15T21:52:44","slug":"quantalrf-samples-wi-fi-7-cmos-front-end-modules-to-tier-1-mobile-soc-players","status":"publish","type":"post","link":"https:\/\/quantalrf.com\/wp1\/quantalrf-samples-wi-fi-7-cmos-front-end-modules-to-tier-1-mobile-soc-players\/","title":{"rendered":"QuantalRF Samples Wi-Fi 7 CMOS Front-end Modules to Tier-1 Mobile SoC Players"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\" style=\"line-height:1.5\"><strong>ZURICH, Switzerland \u2013 April 8, 2025<\/strong>&nbsp;\u2013 QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, samples its innovative Wi-Fi 7 CMOS front-end module (FEM) to two Tier-1 mobile SoC players. The&nbsp;<a href=\"https:\/\/quantalrf.com\/wp1\/elementum\/qwx27120\/\">QWX27120<\/a>, a 5-7 GHz CMOS FEM designed for Wi-Fi 7, fully integrates a patent-pending power amplifier (PA) architecture, an SP3T switch, and a low-noise-amplifier (LNA) into a monolithic CMOS die. Optimized for Wi-Fi 7 applications in smartphones, AR\/ VR, tablets, laptops and smart home devices, this all-silicon solution outperforms competing GaAs and SiGe products in power efficiency, size, RF performance, and cost.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\" style=\"line-height:1.5\">The QWX27120, part of the QuantalRF Elementum&#x2122; family of Wi-Fi 7 products, builds on the success of its predecessors with enhanced features, including a power detector output. Fabricated in CMOS SOI technology, the QWX27120 leverages QuantalRF\u2019s unique PA architecture to reduce power consumption, enabling devices to achieve a longer battery life and reduce heat dissipation. The CMOS FEM also enables a high degree of on-chip configurability, allowing for the versatile reconfiguration for different supply voltages, channels, and linear\/ non-linear operational modes. Selectable high\/low transmit gain modes and digital pre-distortion (DPD) further improve power efficiency.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\" style=\"line-height:1.5\">\u201cWi-Fi 7\u2019s advanced features and higher data rates pose significant power consumption challenges,\u201d said Dr. Ali Fard, CEO and CTO of QuantalRF. \u201cOur innovative PA architecture\u2014integrated within a monolithic CMOS SOI platform\u2014delivers superior linear output power and best-in-class power efficiency. With the QWX27120 Wi-Fi 7 FEM now sampling, we are ready to collaborate with more customers to turbocharge their Wi-Fi efficiency with intelligent and adaptive technology.\u201d<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>&nbsp;<\/strong><strong>QWX27120 Features &amp; Benefits:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li style=\"line-height:1.5\"><strong>Wi-Fi 6E and Wi-Fi 7 compatible&nbsp;<\/strong>\u2013 supports 5150\u20137125 MHz<\/li>\n\n\n\n<li style=\"line-height:1.5\"><strong>Superior power efficiency&nbsp;<\/strong>\u2013 reduces power consumption by up to 50-percent<\/li>\n\n\n\n<li style=\"line-height:1.5\"><strong>Power detector output&nbsp;<\/strong>\u2013 provides real-time power monitoring<\/li>\n\n\n\n<li style=\"line-height:1.5\"><strong>Ultra-small form factor&nbsp;<\/strong>\u2013 integrates all RF front-end components into a single die, available in a 2 x 2mm LGA package or as a flip-chip die.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Samples and evaluation kits are now available.&nbsp;<a href=\"https:\/\/quantalrf.com\/wp1\/contact\/\">Contact QuantalRF<\/a>&nbsp;for more information.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\" style=\"line-height:1.4\"><strong>Media Contact:<br><\/strong>Dave Aichele<br>EVP Sales &amp; Business Development<br><a href=\"mailto:dave.aichele@quantalrf.com\">dave.aichele@quantalrf.com<\/a><br>+1 858-401-6444<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Supporting 5-7 GHz, the intelligent and adaptive QWX27120 integrates all RF front-end components into a monolithic CMOS SOI solution<\/p>\n","protected":false},"author":1,"featured_media":2180,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-2178","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pr-news"],"_links":{"self":[{"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/posts\/2178","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/comments?post=2178"}],"version-history":[{"count":7,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/posts\/2178\/revisions"}],"predecessor-version":[{"id":2882,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/posts\/2178\/revisions\/2882"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/media\/2180"}],"wp:attachment":[{"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/media?parent=2178"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/categories?post=2178"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/quantalrf.com\/wp1\/wp-json\/wp\/v2\/tags?post=2178"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}